COMPANY
The journey for distinguished technologies,
creative thinking, and growth continues.
History
Here are the traces of FST that were made with the customers.
-
2001
Company name changed to FST Inc. KeeHung factory opened and HQ moved
-
2000
Registered in KOSDAQ
-
1999
Developed Deep-UV(ArF) Pellicle
-
1998
Developed Thermo-electric Chiller
-
1993
Developed Deep-UV(KrF) Pellicle
-
1989
Established Corporate R&D Center (Fine Technology R&D Center)
-
1988
Succeeded in the domestic manufacturing of the pellicle
-
1987
Established Fine Semiconductor Technology Co. (Capital: 50 million KRW)
-
2017
Selected 100 billion venture company
Shipped 10,000th chiller -
2016
Signed a win-win agreement with ESI
Dongtan Main Building constructed -
2015
Developed the electric chiller for 300mm wafer Shipped 7,000th chiller Acquired the Solution Division
-
2014
Opened a workplace daycare center
-
2013
Established China Xian Corporation Produced over 5,000 chillers
-
2012
Opened new facilities in Dongtan
-
2011
Opened new facilities in Osan
-
2007
Company name changed
( FST Inc. → FINE SEMITECH Corp.) -
2005
Declared to follow business ethics
-
2004
Completed the development of LCD pellicle
- 2023
ISO 22301 Certification
Selection of Samsung Electronics Co., Ltd. as an excellent partner - 2022
Establishing FST USA
- 2021
Chiller topped 19,000 units
World's First EPMD Equipment Development Completed -
2020
Establishment of Fine Ceratech
-
2019
Completion of Banggyo Plant
Completion of F-line of Osan Plant -
2018
Samsung Electronics won the Outstanding Innovation Award at the
Global Environmental Safety Innovation Competition
Establishment of Isol
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